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HardInterconnectOn-chip wire

A logic gate switches in 5 ps. So why does a 1 mm wire take 12.5 ns?

On the thinnest metal of a ~3 nm-class chip, a wire's resistance and its capacitance both grow with length, so its delay grows with length squared. Repeaters break that square, but each one costs a little delay of its own.

1 mm of the thinnest metal · r ≈ 178 Ω/µm, c ≈ 0.18 fF/µm · unbroken, 12.5 ns to the 50% point
Cut it into 10 pieces with a repeater between each. How much faster does the signal arrive?
Pick one first. Each option tells you why it is right or wrong.

Worked solutionOne step at a time

What the thinnest wire is made of

At a ~3 nm-class node the lowest metal is about 12 nm wide and 24 nm tall. A barrier liner of about 1.5 nm takes part of that, and copper this thin conducts about 2× worse than bulk copper, because electrons scatter off the surfaces and grain boundaries. Taking 3.6 µΩ·cm over the 9 × 22.5 nm copper core:

r = ρ / A ≈ 3.6e-8 Ω·m / 202.5 nm² ≈ 178 Ω/µm c ≈ 0.18 fF/µm

A distributed RC line: delay grows as L²

Every micron adds resistance and every micron adds capacitance that has to be charged through all the resistance before it. The Elmore estimate of the 50% delay of the wire alone is

t ≈ 0.38 · r · c · L² = 0.38 × 178 kΩ × 180 fF ≈ 12.2 ns (L = 1 mm)

Add the driver and the receiving gate (a repeater-sized inverter: 1.2 kΩ drive, 1.25 fF input, 1 fF own output) and you get 12.46 ns. Simulating the wire as a 100-section RC ladder and solving the step response exactly gives 12.45 ns. A FO4 logic gate here takes about 5 ps: the wire is about 2,500 gates long. Doubling the length to 2 mm multiplies the delay by 3.95.

One repeated stage

Cut the wire into 10 pieces of 100 µm. Each repeater drives one piece and the next repeater's input:

0.69·R_D·(C_par + c·l + C_in) + 0.38·r·c·l² + 0.69·r·l·C_in
= 16.8 ps + 121.8 ps + 15.4 ps ≈ 154 ps (ladder simulation: 156.4 ps)

The wire part fell 100× (from 12.2 ns to 0.12 ns), but the repeater and load parts did not shrink much.

Answer: B, about 8×

Ten stages: 10 × 156.4 ps = 1.56 ns, against 12.45 ns for the unbroken wire. The speed-up is 7.96×. The L² term only drops by the number of pieces (10×), and each repeater adds about 30 ps on top, so the real gain is a little under 10×.

What the model showedDelay against the number of pieces

The reel's model (c3-wire-delay/model.py) simulates every stage as an RC ladder driven through the repeater's resistance and measures the 50% time. Total delay for the 1 mm wire:

  • 1 piece (no repeaters): 12.45 ns
  • 2 pieces: 6.40 ns
  • 5 pieces: 2.77 ns
  • 10 pieces: 1.56 ns
  • 20 pieces: 0.98 ns
  • 50 pieces: 0.67 ns

The gains shrink as the repeaters' own delay starts to dominate. These are order-of-magnitude numbers from stated assumptions, not from a specific foundry's design kit.

Wrong answersWhy each one is tempting

PickWhat went wrong
A · about 2×Assumed the repeaters eat most of the gain. At 10 pieces they add only about a fifth of the total.
C · about 30×A guess between 10× and 100×. Ten pieces can never beat 10× on the wire term alone.
D · about 100×Used the per-piece saving (1/k²) and forgot that the signal crosses all k pieces.

Follow-ups an interviewer asks nextTry these before opening them

What is the best number of repeaters?

Balance the wire term (falls as 1/k) against the repeater cost (grows as k). The optimum is k ≈ √(0.38·r·c·L² / (0.69·R_D·(C_par + C_in))), which is in the tens for this wire and repeater. Past that the delay rises again; in practice designers also count area and power and use fewer.

With optimal repeaters, how does delay grow with length?

Linearly. Each segment has a fixed best length, so a longer wire just has more of the same segments. Repeaters turn L² into L.

Why not just route it on a thicker metal layer?

That is the usual first fix. Upper layers are many times wider and taller, so r falls by 10× to 100× while c stays near 0.2 fF/µm. Long routes go up; the thinnest layers are kept for short local connections.

Why does copper get worse as it gets thinner?

Electrons in copper travel about 40 nm between collisions. In a 12 nm wire they hit the surfaces and grain boundaries much more often, and the barrier liner, which barely conducts, takes a bigger share of the cross-section. This is why alternatives such as ruthenium and molybdenum are studied for the thinnest layers.

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